On the afternoon of November 18, the "Semiconductor Strategic Cooperation Online Roadshow China-Israel", hosted by the Eastern National Technology Transfer Center (hereinafter referred to as "Eastern Center") and co-organized by Taiku (Tel Aviv) and Sheng-BDO, was successfully held. The event especially invited a number of domestic listed companies, including China Electronics Zhenhua Group, Shanghai Xinyang Semiconductor and Tongfoo Microelectronics, as well as well-known industry investment institutions such as Yonggui Dongke, Infinity, Walden Capital, Shanghai Xinxin Microelectronics, Lianxin Capital, Living Water Capital to participate in the event. The practicality of the project docking on the ground. In addition, this roadshow, as one of the activities of the "Belt and Road" Science and Technology Innovation Alliance, will also promote the exchange of science and technology between the two countries, the actual needs of enterprises, from the market fundamentals, the substantive promotion of Sino-Israeli technology transfer cooperation.

During the roadshow, NewsightImaging, an image sensor chip for machine vision and spectral analysis, Tera-Pass, a fiber optic transmission network processor, Opsys Tech, a fiber optic for industrial and defense applications, and Micro Assembly Technologies, a chip mount equipment company, presented their current high-end technologies and products and elaborated on the need for cooperation in China, which received extensive attention from Chinese enterprises and investment institutions.

Against the backdrop of global geopolitical and economic influences and the long-armed jurisdiction of the U.S. over the semiconductor industry in China, the Eastern Center, with its long-standing presence in the region, coordinated the participation of multiple organizations and local enterprises in the roadshow, which also allowed Chinese companies to experience the friendly attitude of Israel's technology towards China on the road to future technological self-reliance.

The event is the third China-Israel strategic cooperation online roadshow organized by the Eastern Center this year, and since taking over the construction of the China-Israel technology transfer platform in 2018, the Eastern Center has been actively promoting the work of China-Israel and accelerating the development of technology factor market construction that meets the needs of the two regions. Next, the Eastern Center will further connect the project side of this roadshow with domestic enterprises to establish effective communication mechanisms and cooperation methods, and will also further improve the construction of channels for domestic enterprises to exchange technologies internationally, helping high-quality international technologies to "bring in" and advanced domestic technologies to "go out " to help China build a technology highland with global influence.

Newsight Imaging has developed an advanced complementary metal oxide semiconductor (CMOS) image sensor chip for 3D machine vision and spectral analysis. The company's depth camera sensors for machine vision are specifically designed for highly reliable, accurate, portable and affordable 3D image sensing.

Tera-Pass has developed advanced optical transport network (OTN) processors designed to enable operators to move towards superfast broadband mobile services by quickly and cost-effectively deploying Long Term Evolutionary Advanced (LTE-A).

Opsys Tech develops solid-state lidar and fiber optic technology for industrial defense. The company's innovative solid-state scanning lidar is a holistic semiconductor-based solution with no moving parts, high reliability and a wide operating temperature range.

04  MicroAssembly Technologies, a chip mount equipment company

MAT develops, manufactures and sells capital equipment for the global semiconductor and microelectronics industries, particularly in the field of chip bonding. The company's chip bonders (or chip mounters) precisely place and connect semiconductor components such as ASICs, microprocessors, sensors, microelectromechanical systems (MEMS), VCSELs, etc. to their substrates by means of bonding or metallurgical processes.